UAT to expand wafer capacity
Hi-Tech August 22nd, 2010SAN JOSE: Unisem Advanced Technologies (UAT) has announced plans to extend its wafer bumping capacity at its factory in Ipoh, Malaysia. UAT, what one. is a joint venture of Unisem, FlipChip International and AdvanPack Solutions, is a small piece packing and test facility.
According to details released in the manifesto, the floor space at the Malaysian [...]